PU Solvent Less Adhesives for Flexible Packaging
Advanced Bonding Solutions for Flexible Packaging & High-Performance Lamination
Albatros India offers high-performance PU Solvent Less Glues specifically designed for modern flexible packaging and lamination applications. Our solvent-free polyurethane adhesive systems deliver exceptional bonding strength, prompt adhesion development, and reliable performance across various substrates.
Key Benefits
100% Solvent-Free Technology
Excellent initial and final bond strength
Outstanding adhesion to a wide range of films and foils
Excellent resistance to heat, moisture, and chemicals
Low odour and low VOC characteristics
Suitable for high-speed lamination processes
Good flexibility and durability
Exceptional optical appearance with minimal defects
Optimized for efficient production and reduced adhesive consumption
Available in grades tailored to diverse packaging needs
Suitable Applications
Our PU Solvent Less Glues are ideal for flexible packaging, food packaging, pharmaceutical packaging, retort applications, snack packaging, pouches, sachets, metallized films, and aluminium foil laminations.
Substrate Compatibility
Designed for laminating various combinations of PET, BOPP, CPP, PE, PA, aluminium foil, metallized films, and other specialty packaging films depending on the specific grade and application.
Albatros India Advantage
With an emphasis on consistent quality, application expertise, and customized adhesive solutions, Albatros India provides PU Solvent Less Adhesives engineered for dependable performance, productivity, and long-term bond durability. We also offer solvent-based adhesives for specific requirements.
Stronger Bonds. Cleaner Technology. Better Performance.
Solvent Based Glue
Solvent-based polyurethane (PU) adhesives are high-performance glues that use volatile solvents (like acetone or MEK) to dissolve PU resins. Highly valued for their incredible flexibility, water resistance, and tough bonds, they dry quickly upon evaporation and are widely used in industrial lamination.
Key Characteristics & Benefits
- High Peel Strength: Offers incredibly durable, long-lasting bonds.
- Temperature & Moisture Resistance: Resistant to both high/low temperatures and water exposure.
- Versatility: Effectively binds tricky substrates like plastics, rubbers, leather, wood, and metals.
- Fast Curing: Solvents evaporate quickly, making them highly efficient for mass production lines.
Two-components OH solvent-based adhesive system with elevated chemical and thermal resistance. Suggested for PET/ALU structures involved in electrical cable insulation, but can also be used with other different plastic substrates. Adhesive suitable for structures such as PET/ALU, PET/ALU/PE, PET/ALU/CPP and all barrier film structures. The high, non-volatile portion of the system allows high concentration coating and application, including paper.